Apollo UBM/RDL/BSM
PVD 100-200 mm Wafer Processing/ 100-200mm 晶圆处理
Configurable for up to 5 targets deposition / 最多可配置五种不同的靶材
● UBM/RDL/BSM 凸块下金属层/重布线/背金工艺
● RF Filters/ 射频滤波器晶圆级封装
● Power Devices/ 功率器件封装
Features 特征
● True Bridge Tool capability / 灵活的桥接能力
● Fragile & thin wafer process / 易碎片，薄片处理能力
● Small footprint / 较小的占地面积
● In-line architecture/ 线性式结构设计
● Temperature & stress control / 温度及应力控制
Substrates 基板
● Silicon, Glass, Bonded wafers, Thin/TAIKO, GaAs, SiC, LiNb, LiTa / 硅片，玻璃，键合晶圆，减薄晶圆，铌酸锂，钽酸锂，砷化镓，碳化硅等
